The failure of the optocoupler, highlighted by the electrical test, might have several origins, related to components and bonding wires interconnections and thermo-mechanical stress.
Hence the two different X-ray scans were performed on the optocoupler: the first scan for the visualization of the whole sample and the second one to zoom in on the LED to observe in more detail the die-attach area.
Both scans enhance sharp details likewise a balanced contrast and brightness that are needed to accurately see the main inside components of the optocoupler. The 4 LEDs and the photodiode can be precisely inspected as well as the die attach areas of each LED.